Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US16596953Application Date: 2019-10-09
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Publication No.: US10978575B2Publication Date: 2021-04-13
- Inventor: Hao Deng
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201710169123.1 20170321
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/762 ; H01L29/423 ; H01L21/768 ; H01L21/02 ; H01L29/51 ; H01L29/49 ; H01L21/28

Abstract:
A semiconductor structure is provided and includes a substrate; a gate dielectric layer on the substrate; a dielectric barrier layer structure on the gate dielectric layer; a work function layer on the dielectric barrier layer structure; a gate barrier layer structure on the work function layer; and a gate electrode layer on the gate barrier layer structure. The dielectric barrier layer structure is doped with silicon and the gate barrier layer structure is doped with silicon.
Public/Granted literature
- US20200044050A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2020-02-06
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