Invention Grant
- Patent Title: Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, and method for producing organic semiconductor element
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Application No.: US16740535Application Date: 2020-01-13
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Publication No.: US10978641B2Publication Date: 2021-04-13
- Inventor: Toshihiko Takeda , Hiroshi Kawasaki , Katsunari Obata
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Burr & Brown, PLLC
- Priority: JP2014-117755 20140606,JP2015-109699 20150529
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L51/56 ; C23C14/24 ; C23C14/04 ; C23C16/04

Abstract:
A vapor deposition mask capable of correctly performing confirmation of whether a shape pattern of openings formed in a resin mask is normal or similar confirmation while satisfying both high definition and lightweight, a vapor deposition mask preparation body for obtaining the vapor deposition mask, a frame-equipped vapor deposition mask including the vapor deposition mask, and a method for producing an organic semiconductor element using the frame-equipped vapor deposition mask. The aforementioned problem is solved by using, in a vapor deposition mask including a metal mask in which a through hole is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the through hole, the metal mask and the resin mask being stacked, wherein the resin mask has about 40% or less of light ray transmittance at a wavelength of about 550 nm.
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Information query
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