Invention Grant
- Patent Title: Well thermalized stripline formation for high-density connections in quantum applications
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Application No.: US16908009Application Date: 2020-06-22
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Publication No.: US10978769B2Publication Date: 2021-04-13
- Inventor: Salvatore B. Olivadese , Patryk Gumann , Jerry M. Chow
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Garg Law Firm, PLLC
- Agent Rakesh Garg; Keivan Razavi
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P5/08 ; H01P11/00 ; H01P1/30
Abstract:
A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.
Public/Granted literature
- US20200321675A1 WELL THERMALIZED STRIPLINE FORMATION FOR HIGH-DENSITY CONNECTIONS IN QUANTUM APPLICATIONS Public/Granted day:2020-10-08
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