Invention Grant
- Patent Title: 3D antenna for integrated circuits
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Application No.: US16568533Application Date: 2019-09-12
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Publication No.: US10978781B2Publication Date: 2021-04-13
- Inventor: Jeng-Shien Hsieh , Chung-Hao Tsai , Chuei-Tang Wang , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01Q1/36
- IPC: H01Q1/36 ; H01Q1/22 ; H01Q1/38 ; H01Q1/48 ; H01Q9/04 ; H01L23/48 ; H01L23/498 ; H01L23/522

Abstract:
An antenna comprises a first layer having a first redistribution layer, a feeding line, a ground connection element, and one or more antenna inputs. The antenna also comprises one or more intermediate layers over the first layer. The antenna further comprises a second layer having a second redistribution layer over the one or more intermediate layers. The antenna additionally comprises one or more through vias arranged to communicatively couple the second redistribution layer and the first redistribution layer. The antenna also comprises a short element. The antenna further comprises one or more radiator antennas within the one or more through vias, the one or more radiator antennas being in communication with the one or more antenna inputs by way of the feeding line.
Public/Granted literature
- US20200028240A1 3D Antenna for Integrated Circuits Public/Granted day:2020-01-23
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