Invention Grant
- Patent Title: Chip antenna module
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Application No.: US16456048Application Date: 2019-06-28
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Publication No.: US10978785B2Publication Date: 2021-04-13
- Inventor: Seong Hee Choi , Sang Jong Lee , Sung Yong An , Jae Yeong Kim , Ju Hyoung Park
- Applicant: Samsung Electro-Mechanics., Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics., Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics., Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0107603 20180910,KR10-2018-0137297 20181109
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/38 ; H01Q13/08 ; H01Q5/10 ; H01Q21/24 ; H01Q9/30

Abstract:
An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
Public/Granted literature
- US20200083593A1 CHIP ANTENNA MODULE Public/Granted day:2020-03-12
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