Invention Grant
- Patent Title: Connector for mounting to a substrate
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Application No.: US16486669Application Date: 2018-02-16
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Publication No.: US10978817B2Publication Date: 2021-04-13
- Inventor: Junichi Miyamoto , Hironori Kanda , Toshihiro Oka , Shigeyasu Kitamura , Masao Yamamoto
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2017-031682 20170223
- International Application: PCT/JP2018/005437 WO 20180216
- International Announcement: WO2018/155330 WO 20180830
- Main IPC: H01R13/652
- IPC: H01R13/652 ; H01R12/71 ; H01R13/6581

Abstract:
A substrate-mounting connector includes a housing, a contact mounted to the housing, and a shield shell. The shield shell includes a first plate and a second plate disposed adjacently. A part of the first plate serves as a first contact portion. A first extension piece is formed in the second plate. A part of the first extension piece serves as a second contact portion. A part of the housing serves as a pressing portion facing the first plate, in a covering state in which the shield shell is mounted to the housing. A part of the first plate, different from the first contact portion, or a part of the first extension piece, different from the second contact portion, serves as a pressed portion pressed by the pressing portion in the covering state. The pressing portion presses the pressed portion to make the first contact portion contact the second contact portion.
Public/Granted literature
- US20200059023A1 CONNECTOR FOR MOUNTING TO A SUBSTRATE Public/Granted day:2020-02-20
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