Invention Grant
- Patent Title: Wire terminal crimping method
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Application No.: US16019789Application Date: 2018-06-27
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Publication No.: US10978846B2Publication Date: 2021-04-13
- Inventor: Kazuhiko Takada
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JPJP2017-126626 20170628
- Main IPC: H01R43/04
- IPC: H01R43/04 ; H01R43/048 ; H01R43/058 ; H01R43/052 ; H01R43/055

Abstract:
A terminal crimping device crimps a terminal metal fitting positioned at a crimping position to an electric wire. The device includes an anvil which is positioned under the crimping position, a crimper which is positioned above the crimping position, a pressing mechanism which presses down the crimper to crimp the terminal metal fitting to the electric wire with the anvil and the crimper, a terminal supply mechanism to supply the terminal metal fitting to the crimping position, a position adjusting mechanism which is provided in the terminal supply mechanism to adjust a position of the terminal metal fitting for the crimping position, and a photographing device to photograph the terminal metal fitting fed to the crimping position.
Public/Granted literature
- US20190006809A1 Terminal Crimping Device and Terminal Crimping Method Public/Granted day:2019-01-03
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