A vapor chamber with circuit unit is provided, which has a first flexible substrate structure and a second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure relatively enclose a working fluid. A plurality of wicking spaces is formed between the first flexible substrate structure and the second flexible substrate structure. A circuit unit is formed at least partially on the side of the first flexible substrate structure away from the working fluid, so as to integrate the electronic components and circuit units, and to evenly dissipate the heat generated by the electronic components and circuit units. The vapor chamber with circuit unit makes an effective improvement to the space efficiency of the electronic device.