Invention Grant
- Patent Title: System and method for depositing a metal to form a three-dimensional part
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Application No.: US15052034Application Date: 2016-02-24
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Publication No.: US10994371B2Publication Date: 2021-05-04
- Inventor: William S Yerazunis , John C Barnwell, III , William T Vetterling
- Applicant: Mitsubishi Electric Research Laboratories, Inc.
- Applicant Address: US MA Cambridge
- Assignee: Mitsubishi Electric Research Laboratories, Inc.
- Current Assignee: Mitsubishi Electric Research Laboratories, Inc.
- Current Assignee Address: US MA Cambridge
- Agent Gennadiy Vinokur; Hironori Tsukamoto
- Main IPC: B23K26/346
- IPC: B23K26/346 ; B23K26/14 ; B23K26/342 ; B23K26/08 ; B33Y10/00 ; B33Y30/00

Abstract:
A system and method depositing metal to form a three-dimensional (3D) part on a substrate. A wire is moved relative to a location on the substrate while a laser heats a proximal end of the wire at the location using a laser beam. The laser causes the wire and substrate to reach a melting point of the wire to fuse the wire at the location on the substrate. The wire can be preheated by passing a current through the wire.
Public/Granted literature
- US20170239753A1 System and Method for Depositing a Metal to Form a Three-Dimensional Part Public/Granted day:2017-08-24
Information query
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