Invention Grant
- Patent Title: Laser processing machine and laser processing method
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Application No.: US16097973Application Date: 2018-10-02
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Publication No.: US10994374B2Publication Date: 2021-05-04
- Inventor: Takaaki Yamanashi , Kouji Funaki , Dennis Pohle
- Applicant: AMADA HOLDINGS CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: DE102018203899.6 20180314
- International Application: PCT/JP2018/036909 WO 20181002
- International Announcement: WO2019/176149 WO 20190919
- Main IPC: B23K26/064
- IPC: B23K26/064 ; B23K26/06 ; B23K26/38 ; B23K26/00 ; B23K26/08 ; B23K37/02 ; B23K37/04 ; B23K101/18 ; B23K103/04

Abstract:
The laser processing machine includes a beam oscillation mechanism that oscillates a beam spot on a surface of a sheet metal. The control device controls the beam oscillation mechanism so as to oscillate the beam spot with an oscillation component in a direction orthogonal to a cutting direction of the sheet metal in a non-holding region, in which a holding portion of the conveyance apparatus for conveying a product is not held, when cutting the product from the sheet metal by irradiating the sheet metal with the laser beam. The non-holding region is at least a part of a periphery of a protrusion portion of the product, or at least a part of a periphery of a recess forming region in which a recess of the product is formed.
Information query
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