Invention Grant
- Patent Title: Three-dimensional shaping apparatus
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Application No.: US16722539Application Date: 2019-12-20
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Publication No.: US10994482B2Publication Date: 2021-05-04
- Inventor: Kohei Yuwaki , Koichi Saito , Kazuhide Nakamura
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2018-244829 20181227
- Main IPC: B29C64/209
- IPC: B29C64/209 ; B29C64/245 ; B29C64/295 ; B29C64/227 ; B33Y30/00

Abstract:
A three-dimensional shaping apparatus includes a discharge mechanism, a tilting mechanism, and a control portion. the discharge mechanism includes a supply flow path, a first branch flow path, a second branch flow path, a coupling portion coupling the supply flow path with the first branch flow path and the second branch flow path, a first nozzle communicating with the first branch flow path, a second nozzle communicating with the second branch flow path, and a valve mechanism, a central axis of the first nozzle and a central axis of the second nozzle are separated from each other as going toward the table, and the control portion controls the valve mechanism to switch between a first state in which the supply flow path and the first branch flow path communicate with each other and the supply flow path and the second branch flow path are blocked from each other and a second state in which the supply flow path and the second branch flow path communicate with each other and the supply flow path and the first branch flow path are blocked from each other and controls the tilting mechanism so that in the first state, the first nozzle is brought closer to the table than the second nozzle and in the second state, the second nozzle is brought closer to the table than the first nozzle.
Public/Granted literature
- US20200207017A1 THREE-DIMENSIONAL SHAPING APPARATUS Public/Granted day:2020-07-02
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