Invention Grant
- Patent Title: Fluid flow structure forming method
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Application No.: US16920313Application Date: 2020-07-02
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Publication No.: US10994539B2Publication Date: 2021-05-04
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US CO Fort Collins
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US CO Fort Collins
- Agency: Rathe Lindenbaum LLP
- Priority: WOPCT/US2013/028207 20130228,WOPCT/US2013/028216 20130228,WOPCT/US2013/033046 20130320,WOPCT/US2013/033865 20130326,WOPCT/US2013/048214 20130627
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.
Public/Granted literature
- US20200331272A1 FLUID FLOW STRUCTURE FORMING METHOD Public/Granted day:2020-10-22
Information query
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