Invention Grant
- Patent Title: Method for producing a microelectromechanical component and wafer system
-
Application No.: US16476455Application Date: 2017-12-15
-
Publication No.: US10994989B2Publication Date: 2021-05-04
- Inventor: Vijaye Rajaraman , Eckart Schellkes
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Norton Rose Fulbright US LLP
- Agent Gerard Messina
- Priority: DE102017200162.3 20170109
- International Application: PCT/EP2017/083069 WO 20171215
- International Announcement: WO2018/127385 WO 20180712
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G01L9/00 ; B81C1/00
Abstract:
A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.
Public/Granted literature
- US20200055727A1 METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT AND WAFER SYSTEM Public/Granted day:2020-02-20
Information query
IPC分类:
