Invention Grant
- Patent Title: Polyamide resin composition
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Application No.: US15761256Application Date: 2016-10-03
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Publication No.: US10995199B2Publication Date: 2021-05-04
- Inventor: Masaya Tonari , Seiichi Arakawa , Akio Miyamoto
- Applicant: UBE INDUSTRIES, LTD.
- Applicant Address: JP Ube
- Assignee: UBE INDUSTRIES, LTD.
- Current Assignee: UBE INDUSTRIES, LTD.
- Current Assignee Address: JP Ube
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2015-200937 20151009
- International Application: PCT/JP2016/079253 WO 20161003
- International Announcement: WO2017/061363 WO 20170413
- Main IPC: C08K7/14
- IPC: C08K7/14 ; C08L77/00 ; C08L77/02 ; C08J5/00 ; C08J5/04

Abstract:
The present invention provides a polyamide resin composition capable of simultaneously satisfying, with regard to a molded body, suppression of dimensional change upon water absorption, excellent abrasion resistance after water absorption, excellent impact strength, and high surface strength.
The present invention relates to a resin composition comprising a glass fiber having a non-circular cross section, and a polyamide resin having a structural unit having more than 6 carbon atoms per 1 amide group, wherein a number average molecular weight of the polyamide resin is 20000 to 40000, and a content of the glass fiber is 15 mass % to 60 mass %.
The present invention relates to a resin composition comprising a glass fiber having a non-circular cross section, and a polyamide resin having a structural unit having more than 6 carbon atoms per 1 amide group, wherein a number average molecular weight of the polyamide resin is 20000 to 40000, and a content of the glass fiber is 15 mass % to 60 mass %.
Public/Granted literature
- US20180273728A1 POLYAMIDE RESIN COMPOSITION Public/Granted day:2018-09-27
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