- Patent Title: Solder mask inkjet inks for manufacturing printed circuit boards
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Application No.: US16348163Application Date: 2017-11-07
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Publication No.: US10995229B2Publication Date: 2021-05-04
- Inventor: Rita Torfs , Marion Sauvageot , Johan Loccufier
- Applicant: AGFA-GEVAERT NV , ELECTRA POLYMER LTD.
- Applicant Address: BE Mortsel; GB Kent
- Assignee: AGFA-GEVAERT NV,ELECTRA POLYMER LTD.
- Current Assignee: AGFA-GEVAERT NV,ELECTRA POLYMER LTD.
- Current Assignee Address: BE Mortsel; GB Kent
- Agency: Stinson LLP
- Priority: EP16198090 20161110
- International Application: PCT/EP2017/078390 WO 20171107
- International Announcement: WO2018/087055 WO 20180517
- Main IPC: C09D11/38
- IPC: C09D11/38 ; C09D11/037 ; C09D11/101 ; C09D11/107 ; C09D11/322 ; H05K3/28 ; H05K1/09 ; B41M5/00 ; B41J2/01

Abstract:
An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one mercapto functionalized carboxylic acid as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.
Public/Granted literature
- US20190300739A1 SOLDER MASK INKJET INKS FOR MANUFACTURING PRINTED CIRCUIT BOARDS Public/Granted day:2019-10-03
Information query
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