- Patent Title: In situ tailoring of material properties in 3D printed electronics
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Application No.: US15477700Application Date: 2017-04-03
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Publication No.: US10995406B2Publication Date: 2021-05-04
- Inventor: Ramprasad Gandhiraman , Meyya Meyyappan , Jessica E. Koehne
- Applicant: Universities Space Research Association
- Applicant Address: US CA Mountain View
- Assignee: Universities Space Research Association
- Current Assignee: Universities Space Research Association
- Current Assignee Address: US CA Mountain View
- Agency: Whiteford, Taylor & Preston, LLP
- Agent Peter J. Davis
- Main IPC: C23C16/513
- IPC: C23C16/513 ; C23C16/52 ; B33Y10/00 ; B33Y30/00 ; H05H1/24 ; C23C16/44 ; H05H1/42

Abstract:
Systems and methods for highly reproducible and focused plasma jet printing and patterning of materials using appropriate ink containing aerosol through nozzles with narrow orifice and tubes with controlled dielectric constant connected to high voltage power supply, in the presence of electric field and plasma, that enables morphological and/or bulk chemical modification and/or surface chemical modification of the material in the aerosol and/or the substrate prior to printing, during printing and post printing.
Public/Granted literature
- US20170298516A1 IN SITU TAILORING OF MATERIAL PROPERTIES IN 3D PRINTED ELECTRONICS Public/Granted day:2017-10-19
Information query
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