Invention Grant
- Patent Title: Method of electroless nickle plating on surface of silicon carbide powder
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Application No.: US16207022Application Date: 2018-11-30
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Publication No.: US10995408B2Publication Date: 2021-05-04
- Inventor: Huijing Yang
- Applicant: Tangshan Normal University
- Applicant Address: CN Hebei
- Assignee: Tangshan Normal University
- Current Assignee: Tangshan Normal University
- Current Assignee Address: CN Hebei
- Priority: CN201711383356.8 20180224
- Main IPC: C23C18/36
- IPC: C23C18/36 ; C23C18/16 ; C23C18/18

Abstract:
A method of electroless nickel plating on surface of silicon carbide powder with a uniform and stable coating. In this method, ultrasonic assist is introduced in the pre-treatment and during plating process, and the powder particles in the liquid are dispersed and deagglomerated by the mechanical action and cavitation of the ultrasonic waves, thereby achieving a uniform dispersion of the powder in the dispersant. Furthermore, a reducing agent is slowly added during plating so as to give a more uniform and stable deposition of the coating onto the surface of the powder particles, and thus a silicon carbide core-nickel shell structure with an excellent powder dispersibility and a uniform and stable coating is produced.
Public/Granted literature
- US20190264330A1 METHOD OF ELECTROLESS NICKLE PLATING ON SURFACE OF SILICON CARBIDE POWDER Public/Granted day:2019-08-29
Information query
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