Invention Grant
- Patent Title: Integrated circuit sensor and sensor substrate
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Application No.: US15744516Application Date: 2016-06-10
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Publication No.: US10996198B2Publication Date: 2021-05-04
- Inventor: Kunihiko Iizuka , Akira Saito , Takeshi Mitsunaka , Nobuyuki Ashida
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Sakai
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai
- Agency: ScienBiziP, P.C.
- Priority: JPJP2015-175092 20150904
- International Application: PCT/JP2016/067316 WO 20160610
- International Announcement: WO2017/038196 WO 20170309
- Main IPC: G01N27/72
- IPC: G01N27/72 ; H03B5/12 ; H01L23/31 ; G01N27/22 ; H01L23/48 ; H01L23/498 ; H01L23/00

Abstract:
An integrated circuit sensor that enables, regardless of a type of an inspection object, the inspection object and a front surface of the integrated circuit sensor to be in reliable contact with each other in a large region is provided. A through silicon via (11) that electrically connects an inside of an integrated circuit sensor (4) and an outside of the integrated circuit sensor (4) is formed in the inside of the integrated circuit sensor (4) so as to reach a rear surface of the integrated circuit sensor (4), which faces the front surface of the integrated circuit sensor (4).
Public/Granted literature
- US20180209937A1 INTEGRATED CIRCUIT SENSOR AND SENSOR SUBSTRATE Public/Granted day:2018-07-26
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