A probe card, for testing an electrical characteristic of a device under test (DUT) including a plurality of semiconductor devices, includes a substrate, a first probe pin disposed on a surface of the substrate and including a tip portion capable of contacting a pad of the DUT, and a second probe pin disposed on the surface of the substrate and including a tip portion capable of contacting the pad of the DUT. The first probe pin protrudes further than the second probe pin protrudes from the surface of the substrate in a first direction that is substantially perpendicular to the surface of the substrate.