Invention Grant
- Patent Title: Insulating substrate inspecting method and inspecting apparatus
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Application No.: US16210046Application Date: 2018-12-05
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Publication No.: US10996257B2Publication Date: 2021-05-04
- Inventor: Tetsuya Ueda , Kazuki Sameshima , Hiroki Shiota
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2018-099744 20180524
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/12 ; G01R31/16

Abstract:
An insulating substrate inspecting method includes bringing a lower electrode into contact with lower metal of an insulating substrate including an insulating layer, the lower metal in contact with a lower surface of the insulating layer, and upper metal in contact with an upper surface of the insulating layer, and bringing an upper electrode into contact with the upper metal, and applying an AC voltage to the lower electrode and the upper electrode to detect electromagnetic waves generated at a defect in the insulating layer.
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