Invention Grant
- Patent Title: Optimization of integrated circuit reliability
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Application No.: US16733573Application Date: 2020-01-03
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Publication No.: US10996259B2Publication Date: 2021-05-04
- Inventor: Carole D. Graas , Nazmul Habib , Deborah M. Massey , John G. Massey , Pascal A. Nsame , Ernest Y. Wu , Emmanuel Yashchin
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Calderon Safran & Cole, P.C.
- Agent Steven Meyers; Andrew M. Calderon
- Main IPC: G06F30/30
- IPC: G06F30/30 ; G01R31/26 ; G01R31/28 ; G01R31/50

Abstract:
A per-chip equivalent oxide thickness (EOT) circuit sensor resides in an integrated circuit. The per-chip EOT circuit sensor determines electrical characteristics of the integrated circuit. The measured electrical characteristics include leakage current. The determined electrical characteristics are used to determine physical attributes of the integrated circuit. The physical attributes, including EOT, are used in a reliability model to predict per-chip failure rate.
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