Invention Grant
- Patent Title: Coil component
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Application No.: US16291429Application Date: 2019-03-04
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Publication No.: US10998125B2Publication Date: 2021-05-04
- Inventor: Joung Gul Ryu , Jae Hun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0083389 20180718
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/30 ; H01F27/32

Abstract:
A coil component includes a body including a coil and an external electrode disposed on an external surface of the body to be connected to the coil. The body includes a support member, disposed to support the coil, having a via hole spaced apart from a through-hole. The coil includes a coil body and a coil lead-out portion disposed to connect the coil body and the external electrode to each other. A first support layer is disposed between one surface of the support member and one surface of the coil lead-out portion, and a second support layer is disposed on the first support layer.
Public/Granted literature
- US20200027650A1 Coil Component Public/Granted day:2020-01-23
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