Invention Grant
- Patent Title: Capacitor and electronics module assembly with low-inductance connection features
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Application No.: US16654622Application Date: 2019-10-16
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Publication No.: US10998132B1Publication Date: 2021-05-04
- Inventor: Tomas Manuel Reiter , Karl Niklas
- Applicant: Infineon Technologies AG , TDK Electronics AG
- Applicant Address: DE Neubiberg; DE Munich
- Assignee: Infineon Technologies AG,TDK Electronics AG
- Current Assignee: Infineon Technologies AG,TDK Electronics AG
- Current Assignee Address: DE Neubiberg; DE Munich
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01G2/00 ; H01R12/55 ; H05K5/02

Abstract:
A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.
Public/Granted literature
- US20210118613A1 Capacitor and Electronics Module Assembly with Low-Inductance Connection Features Public/Granted day:2021-04-22
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