- Patent Title: Substrate processing chamber having improved process volume sealing
-
Application No.: US16132962Application Date: 2018-09-17
-
Publication No.: US10998172B2Publication Date: 2021-05-04
- Inventor: Ilya Lavitsky , Keith A. Miller , John Mazzocco
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C14/54 ; C23C14/56 ; C23C14/35 ; C23C14/50 ; C23C14/34

Abstract:
Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber wall defining an inner volume within the process chamber; a substrate support disposed in the inner volume having a support surface to support a substrate, wherein the inner volume includes a processing volume disposed above the support surface and a non-processing volume disposed at least partially below the support surface; a gas supply plenum fluidly coupled to the processing volume via a gas supply channel disposed above the support surface; a pumping plenum fluidly coupled to the processing volume via an exhaust channel disposed above the support surface; and a sealing apparatus configured to fluidly isolate the processing volume from the non-processing volume when the substrate support is in a processing position, wherein the processing volume and the non-processing volume are fluidly coupled when the substrate support is in a non-processing position.
Public/Granted literature
- US20190096638A1 SUBSTRATE PROCESSING CHAMBER HAVING IMPROVED PROCESS VOLUME SEALING Public/Granted day:2019-03-28
Information query