A semiconductor trace structure is provided for carrying a heat source. The semiconductor device package includes a dielectric structure having a first surface configured to receive the heat source and a second surface opposite to the first surface; a cavity defined by the dielectric structure to accommodate a fluid. The cavity includes a first passage portion between the first surface and the second surface. A first area of the first passage portion is closer to the heat source than a second area of the first passage portion, and that the first area is greater than the second area from a top view perspective. A method for manufacturing the semiconductor trace structure is also provided.