A semiconductor device includes a semiconductor body; an electrode provided on the semiconductor body and electrically connected to the semiconductor body; a first metal layer selectively provided on the electrode; an insulating layer surrounding the first metal layer on the electrode; and a second metal layer provided on the first metal layer. The insulating layer includes a first surface and a second surface adjacent to the first surface. The first surface contacts a top surface of the first metal layer at an outer edge of the first metal layer. The second metal layer has an outer edge contacting the second surface of the insulating layer.