Invention Grant
- Patent Title: Grounding terminal and wire harness
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Application No.: US16784433Application Date: 2020-02-07
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Publication No.: US10998650B2Publication Date: 2021-05-04
- Inventor: Daisuke Takaishi
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2019-024712 20190214
- Main IPC: H01R4/60
- IPC: H01R4/60 ; H01R4/72 ; H01R4/18 ; H01R13/03 ; B60R16/02 ; H01R11/12

Abstract:
Provided is a grounding terminal comprising a terminal fitting including a crimp portion, and a fastened portion that is provided on the front lower side of the crimp portion and is to be connected to a grounding surface using a fastening member, the terminal fitting being provided with a stepped portion between the crimp portion and the fastened portion. A covering layer is configured to be formed on the grounding terminal by thermally shrinking a heat-shrinkable tube including, on its inner circumferential portion, a water sealing agent to be used to cover at least the crimp portion of the terminal fitting and seal the electric wire from water. A water sealing agent is configured to be distributed up to the front side with respect to the covering layer as viewed from above, and a hanging-down length d of a water sealing agent is within the range of the stepped portion.
Public/Granted literature
- US20200266558A1 GROUNDING TERMINAL AND WIRE HARNESS Public/Granted day:2020-08-20
Information query