Invention Grant
- Patent Title: Automatic solder paste feeding system
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Application No.: US16532614Application Date: 2019-08-06
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Publication No.: US11000912B2Publication Date: 2021-05-11
- Inventor: Fengchun Xie , Dandan Zhang , Roberto Francisco-Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co. Ltd.
- Applicant Address: CN Shanghai; US PA Berwyn; CN Chengdu; CN Shenzhen
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Corporation,Measurement Specialties (Chengdu) Ltd.,Shenzhen AMI Technology Co. Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Corporation,Measurement Specialties (Chengdu) Ltd.,Shenzhen AMI Technology Co. Ltd.
- Current Assignee Address: CN Shanghai; US PA Berwyn; CN Chengdu; CN Shenzhen
- Agency: Barley Snyder
- Priority: CN201710160006.9 20170317
- Main IPC: B23K3/00
- IPC: B23K3/00 ; B23K3/06 ; B23K101/36
Abstract:
An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
Information query
