Invention Grant
- Patent Title: Laser machining device
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Application No.: US16167559Application Date: 2018-10-23
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Publication No.: US11000918B2Publication Date: 2021-05-11
- Inventor: Mamoru Idaka , Masaki Saito , Hideki Yamakawa , Kazuyoshi Ogawa
- Applicant: Keyence Corporation
- Applicant Address: JP Osaka
- Assignee: Keyence Corporation
- Current Assignee: Keyence Corporation
- Current Assignee Address: JP Osaka
- Agency: Kilyk & Bowersox, P.L.L.C.
- Priority: JPJP2017-239911 20171214
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/082 ; H01S3/0941 ; H01S3/02 ; B23K26/03 ; B23K26/042 ; B23K26/38 ; B23K26/352 ; G02F1/35 ; H01S3/102 ; B23K26/046 ; B23K26/0622 ; B23K26/064 ; H01S3/04 ; H01S3/23 ; H01S3/16 ; H01S3/10 ; H01S3/109 ; H01S3/00 ; H01S3/11 ; H01S3/081

Abstract:
To prevent an output decrease of laser light due to impurities that could be formed in a guide-light emitting device or an imaging device. A laser-light guiding section includes a transmission window section, an optical component disposed to cause an optical path of the UV laser light emitted from the laser-light output section and an optical path of transmitted light transmitted through the transmission window section to cross, and a sealing member in which the transmission window section is provided, the sealing member configuring a sealed space for airtightly housing the optical component. At least one of a guide-light emitting device configured to emit guide light for visualizing a scanning position of the UV laser light toward the transmission window section and an imaging device configured to receive light for imaging a workpiece via the transmission window section is disposed on the outer side of the sealed space.
Public/Granted literature
- US20190184491A1 Laser Machining Device Public/Granted day:2019-06-20
Information query
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