Invention Grant
- Patent Title: Mold changing apparatus
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Application No.: US16526609Application Date: 2019-07-30
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Publication No.: US11000981B2Publication Date: 2021-05-11
- Inventor: Hien Tuong The
- Applicant: Nichietsu Inc.
- Applicant Address: JP Kanagawa
- Assignee: Nichietsu Inc.
- Current Assignee: Nichietsu Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2018-145144 20180801
- Main IPC: B29C45/17
- IPC: B29C45/17 ; B29C31/00
Abstract:
A mold changing apparatus includes a conveyance unit that is configured to generate a driving force for positioning the mold in addition to loading and unloading the mold into and from an injection molding machine, and a fluid pressure cylinder to assist acceleration and deceleration of the mold in cooperation with the conveyance unit.
Public/Granted literature
- US20200039131A1 MOLD CHANGING APPARATUS Public/Granted day:2020-02-06
Information query
