Invention Grant
- Patent Title: Three-dimensional modeling apparatus and three-dimensional modeling method
-
Application No.: US15951350Application Date: 2018-04-12
-
Publication No.: US11000995B2Publication Date: 2021-05-11
- Inventor: Koichi Saito , Shunsuke Mizukami , Kazuhide Nakamura
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2017-089248 20170428
- Main IPC: B33Y30/00
- IPC: B33Y30/00 ; B29C64/209 ; B29C64/40 ; B29C64/295 ; B29C64/241 ; B29C64/106 ; B33Y70/00 ; B33Y10/00
Abstract:
A three-dimensional modeling apparatus includes a drive motor, a plasticizing section having a flat screw configured to be rotated by the drive motor, the plasticizing section being configured to plasticize and convert the material into a molten material by the rotation of the flat screw, and a nozzle configured to inject the molten material.
Public/Granted literature
- US20180311894A1 THREE-DIMENSIONAL MODELING APPARATUS AND THREE-DIMENSIONAL MODELING METHOD Public/Granted day:2018-11-01
Information query
