Invention Grant
- Patent Title: Component mounting apparatus
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Application No.: US16399063Application Date: 2019-04-30
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Publication No.: US11001461B2Publication Date: 2021-05-11
- Inventor: Jong Eok Ban , Byung Ju Kim , Sung Ho Jo , Eun Suk Yoon
- Applicant: HANWHA PRECISION MACHINERY CO., LTD.
- Applicant Address: KR Changwon-si
- Assignee: HANWHA PRECISION MACHINERY CO., LTD.
- Current Assignee: HANWHA PRECISION MACHINERY CO., LTD.
- Current Assignee Address: KR Changwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0053197 20180509
- Main IPC: B65G69/00
- IPC: B65G69/00 ; G02B5/20 ; G02B5/08 ; H04N5/225 ; B65G15/58 ; H04N5/33

Abstract:
A component mounting apparatus includes a component mounting unit including a suction configured to adsorb and transport a component; a first light source configured to emit first light to the component; a second light source configured to emit second light to a Fiducial mark of a substrate; a filter configured to transmit the first light reflected by the component through the filter and reflect the second light reflected by the Fiducial mark; and an image capturer configured to detect the first light transmitted through the filter and the second light reflected by the filter.
Information query
IPC分类: