Invention Grant
- Patent Title: Methods for making high sound transmission class gypsum boards and gypsum boards made by the method
-
Application No.: US16356303Application Date: 2019-03-18
-
Publication No.: US11002010B2Publication Date: 2021-05-11
- Inventor: Suman Sinha Ray , Mark Antosh , Mark Hemphill , Yijun Sang
- Applicant: United States Gypsum Company
- Applicant Address: US IL Chicago
- Assignee: United States Gypsum Company
- Current Assignee: United States Gypsum Company
- Current Assignee Address: US IL Chicago
- Agency: Vorys, Sater Seymour and Pease LLP
- Agent Pradip Sahu; Philip T. Petti
- Main IPC: E04C2/04
- IPC: E04C2/04 ; B32B7/12 ; B32B13/04 ; B32B37/24 ; E04B2/72 ; E04B2/00 ; E04B1/84 ; E04B1/86 ; G10K11/168 ; E04B1/82 ; B32B13/08 ; B32B13/12 ; E04B1/74

Abstract:
A layered gypsum wallboard can include: a gypsum board having opposing front and back faces, wherein the gypsum board comprises a first cover sheet material at the front face, a second cover sheet material at the back face, and a gypsum core layer comprising gypsum; an adhesive layer on the second cover sheet material of the gypsum board, the adhesive including a polymer having a glass transition temperature (Tg) of −10° C. to 30° C.; an intermediate gypsum layer including gypsum on the adhesive layer such that the adhesive layer is between the second cover sheet material and the intermediate gypsum layer, wherein the adhesive layer and the intermediate gypsum layer have a combined thickness of 0.09 inches to 0.25 inches; and a third cover sheet material, wherein the intermediate gypsum layer is between and in contact with the adhesive layer and the third cover sheet material.
Public/Granted literature
- US20190338516A1 METHODS FOR MAKING HIGH SOUND TRANSMISSION CLASS GYPSUM BOARDS AND GYPSUM BOARDS MADE BY THE METHOD Public/Granted day:2019-11-07
Information query
IPC分类: