Invention Grant
- Patent Title: Sensing film with an integrated structure
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Application No.: US16641276Application Date: 2018-10-11
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Publication No.: US11003290B2Publication Date: 2021-05-11
- Inventor: Chung Pui Chan , Wing Hong Choi , Lai Fan Lai , Chien Chung
- Applicant: New Asia Group Holdings Limited
- Applicant Address: HK Hong Kong
- Assignee: New Asia Group Holdings Limited
- Current Assignee: New Asia Group Holdings Limited
- Current Assignee Address: HK Hong Kong
- Agency: Idea Intellectual Limited
- Agent Margaret A. Burke; Sam T. Yip
- International Application: PCT/IB2018/057874 WO 20181011
- International Announcement: WO2019/073428 WO 20190418
- Main IPC: G06F3/044
- IPC: G06F3/044

Abstract:
A flexible transparent sensing film with embedded electrodes is described in the present invention, which would greatly improve the optical transmittance, electrical conductivity and reliability. The present sensing film can also simultaneously enable multiple touches for distinct locations sensing and at least another set of electrical signal sensing. The present sensing film includes a top conductive electrode, a bottom conductive electrode (140) and a dielectric substrate or a functional substrate that would generate electrical signal response due to a specific input such as motion, light, chemical, or temperature. The present sensing film apparatus could be configured to have the top and bottom conductive electrodes which are partially or fully embedded onto the surfaces of the dielectric and/or functional substrates.
Public/Granted literature
- US20200233508A1 SENSING FILM WITH AN INTEGRATED STRUCTURE Public/Granted day:2020-07-23
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