Invention Grant
- Patent Title: Automated wafer monitoring
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Application No.: US16539299Application Date: 2019-08-13
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Publication No.: US11004711B2Publication Date: 2021-05-11
- Inventor: Kuo-Hung Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683 ; H01L21/68
Abstract:
In an embodiment, a system includes: a chuck; multiple groove conduits arranged around a circumference of a wafer position on the chuck; a gas source in fluid communication with the multiple groove conduits; and a flow monitor configured to determine an amount of gas flow from the gas source to an individual one of the multiple groove conduits.
Public/Granted literature
- US20200058530A1 AUTOMATED WAFER MONITORING Public/Granted day:2020-02-20
Information query
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