Invention Grant
- Patent Title: Silicon carbide epitaxial substrate having grooves extending along main surface and method of manufacturing silicon carbide semiconductor device
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Application No.: US16986402Application Date: 2020-08-06
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Publication No.: US11004941B2Publication Date: 2021-05-11
- Inventor: Keiji Wada , Hironori Itoh , Taro Nishiguchi
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Baker Botts L.L.P.
- Agent Michael A. Sartori
- Priority: JPJP2015-228601 20151124
- Main IPC: H01L29/16
- IPC: H01L29/16 ; C30B25/20 ; C30B29/36 ; H01L21/02 ; H01L29/66 ; H01L21/20 ; H01L21/205 ; H01L29/12 ; H01L29/161 ; H01L29/78 ; H01L29/34

Abstract:
A silicon carbide epitaxial substrate has a silicon carbide single-crystal substrate and a silicon carbide layer. An average value of carrier concentration in the silicon carbide layer is not less than 1×1015 cm−3 and not more than 5×1016 cm−3. In-plane uniformity of the carrier concentration is not more than 2%. The second main surface has: a groove 80 extending in one direction along the second main surface, a width of the groove in the one direction being twice or more as large as a width thereof in a direction perpendicular to the one direction, and a maximum depth of the groove from the second main surface being not more than 10 nm; and a carrot defect. A value obtained by dividing a number of the carrot defects by a number of the grooves is not more than 1/500.
Information query
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