Invention Grant
- Patent Title: Terminal module
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Application No.: US16615385Application Date: 2018-05-14
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Publication No.: US11005203B2Publication Date: 2021-05-11
- Inventor: Seido Nishijima
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie; JP Mie; JP Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie; JP Mie; JP Osaka
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JPJP2017-104348 20170526
- International Application: PCT/JP2018/018490 WO 20180514
- International Announcement: WO2018/216523 WO 20181129
- Main IPC: H01R13/08
- IPC: H01R13/08 ; H01R13/24 ; H01R13/187 ; H01R4/48

Abstract:
A terminal module (10) has a metal case (20) with a ceiling wall (21), a bottom wall (51) facing the ceiling wall (21), opposed side walls (23) extending from the ceiling wall (21) toward the bottom wall (51) and retaining pieces (24). A coil spring (40) is sandwiched between the ceiling wall (21) and the bottom wall (51). The retaining pieces (24) face each other in a direction perpendicular to a facing direction of the side walls (23) and project toward the bottom wall (51) from the periphery of the ceiling wall (21). The side walls (23) and the retaining pieces (24) are disposed alternately on the periphery of the ceiling wall (21). A spring receiving portion (26) formed by the ceiling wall (21), the side walls (23) and the retaining pieces (24) receives an end part of the coil spring (40) on the side of the ceiling wall (21).
Public/Granted literature
- US20200373697A1 TERMINAL MODULE Public/Granted day:2020-11-26
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