Invention Grant
- Patent Title: Additively manufactured cooling assemblies for thermal and/or mechanical systems, and methods for manufacturing the assemblies
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Application No.: US16271259Application Date: 2019-02-08
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Publication No.: US11006549B2Publication Date: 2021-05-11
- Inventor: Brian Magann Rush , Corey Bourassa , Lana Osusky , Karthik Bodla , Hendrik Pieter Jacobus de Bock , Naveenan Thiagarajan
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dinsmore & Shohl LLP
- Main IPC: F28D7/00
- IPC: F28D7/00 ; H05K7/20 ; F28F1/00 ; F28F1/40 ; F28F13/12

Abstract:
A cooling assembly includes a body configured to be placed into thermal contact with a heat source and one or more non-planar, hermetic walls disposed within the body. The one or more non-planar hermetic walls extending around, enclosing, and defining a cooling channel configured to carry cooling fluid through the body such that the cooling fluid contacts internal surfaces of the cooling channel inside the body. The assembly including one or more enhancement structures disposed within the body and coupled with the one or more non-planar hermetic walls. The one or more enhancement structures shaped to change a flow path of the cooling fluid as the cooling fluid moves within the cooling channel and shaped to increase a surface area contacted by the cooling fluid within the cooling channel.
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