Invention Grant
- Patent Title: Cloth electronization product and method
-
Application No.: US14114700Application Date: 2012-04-28
-
Publication No.: US11006557B2Publication Date: 2021-05-11
- Inventor: Chang-Ming Yang , Chunmei Chou
- Applicant: Chang-Ming Yang , Chunmei Chou
- Applicant Address: TW Taiwan; TW Miaoli
- Assignee: Chang-Ming Yang,Chunmei Chou
- Current Assignee: Chang-Ming Yang,Chunmei Chou
- Current Assignee Address: TW Taiwan; TW Miaoli
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: WOPCT/CN2011/000758 20110429
- International Application: PCT/CN2012/000574 WO 20120428
- International Announcement: WO2012/146066 WO 20121101
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B29C65/02 ; B32B37/00 ; B32B38/00 ; B32B7/08 ; B32B38/14 ; C08J5/00 ; H05K13/00 ; A61B5/00 ; A61N1/04 ; A61N1/16 ; D05B23/00 ; B29C65/62 ; B32B27/12 ; B29C65/40 ; B29C65/48 ; B29C65/72 ; A61B5/0205 ; A61B5/024 ; A61B5/08 ; A61B5/389

Abstract:
Cloth electronic product, by which physiological information can be examined through cloth, includes a packaging cloth or a heat melt adhesive film as circuit, at least an electronic component, such as resistors, microprocessors and sensing assembly, etc., at least a transmission line to be connected with the conductive region of electronic component. Method of producing a cloth electronic product includes sewing the electronic component on packaging cloth or heat melt adhesive film after being connected with the transmission line, or connecting electronic component with the transmission line during the process of jointing of transmission or sewing of packaging cloth or heat melt adhesive film, and then sewing the packaging cloth on the clothing cloth or integrating the heat melt adhesive film into the packaging cloth or clothing cloth. Original structure of the heat melt adhesive film cannot be viewed and miniaturization effects can be produced.
Public/Granted literature
- US20140084045A1 CLOTH ELECTRONIZATION PRODUCT AND METHOD Public/Granted day:2014-03-27
Information query