Invention Grant
- Patent Title: Electronic component with external electrode including sintered layer and conductive resin layer on the sintered layer
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Application No.: US16250346Application Date: 2019-01-17
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Publication No.: US11011310B2Publication Date: 2021-05-18
- Inventor: Shinya Onodera , Takehisa Tamura , Ken Morita
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-015119 20180131
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G2/06 ; H01G4/12

Abstract:
An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the first direction is smaller than a length of the conductive resin layer in the third direction.
Public/Granted literature
- US20190237261A1 ELECTRONIC COMPONENT Public/Granted day:2019-08-01
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