Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16523914Application Date: 2019-07-26
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Publication No.: US11011478B2Publication Date: 2021-05-18
- Inventor: Ming-Hui Yang , Chun-Ting Liao , Yi-Te Chen , Chen-Yuan Chen , Ho-Chun Liou
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/58

Abstract:
A semiconductor device includes an integrated circuit, an outer seal ring, and an inner seal ring. The outer seal ring forms a first closed loop surrounding the integrated circuit. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring has a first seal portion surrounding the integrated circuit and a second seal portion spaced apart from the first seal portion, a first connector interconnecting the first seal portion and the second seal portion, and a second connector spaced apart from the first connector and interconnecting the first seal portion and the second seal portion. The first seal portion, the second seal portion, the first connector, and the second connector form a second closed loop.
Information query
IPC分类: