Invention Grant
- Patent Title: Transistors and arrays of elevationally-extending strings of memory cells
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Application No.: US16406148Application Date: 2019-05-08
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Publication No.: US11011538B2Publication Date: 2021-05-18
- Inventor: David H. Wells , Luan C. Tran , Jie Li , Anish A. Khandekar , Kunal Shrotri
- Applicant: Micron Technology, inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, inc.
- Current Assignee: Micron Technology, inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L29/51 ; H01L29/10 ; H01L29/06 ; H01L27/11556 ; H01L29/788 ; H01L29/792 ; H01L29/78 ; H01L21/28 ; H01L21/02

Abstract:
A transistor comprises channel material having first and second opposing sides. A gate is on the first side of the channel material and a gate insulator is between the gate and the channel material. A first insulating material has first and second opposing sides, with the first side being adjacent the second side of the channel material. A second insulating material of different composition from that of the first insulating material is adjacent the second side of the first insulating material. The second insulating material has at least one of (a), (b), and (c), where, (a): lower oxygen diffusivity than the first material, (b): net positive charge, and (c): at least two times greater shear strength than the first material. In some embodiments, an array of elevationally-extending strings of memory cells comprises such transistors. Other embodiments, including method, are disclosed.
Public/Granted literature
- US20190267394A1 Transistors And Arrays Of Elevationally-Extending Strings Of Memory Cells Public/Granted day:2019-08-29
Information query
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