Invention Grant
- Patent Title: Vertical transport field-effect transistor (VFET) with dual top spacer
-
Application No.: US16505411Application Date: 2019-07-08
-
Publication No.: US11011624B2Publication Date: 2021-05-18
- Inventor: Shogo Mochizuki , Michael P. Belyansky , Choonghyun Lee
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Erik Johnson
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L21/8238 ; H01L21/8234 ; H01L29/08 ; H01L29/786

Abstract:
A VFET device with a dual top spacer to prevent source/drain-to-gate short, and techniques for formation thereof are provided. In one aspect, a method of forming a VFET device includes: etching vertical fin channels in a substrate; forming a bottom source and drain in the substrate beneath the vertical fin channels; forming a bottom spacer on the bottom source and drain; depositing a gate dielectric and gate conductor onto the vertical fin channels; recessing the gate dielectric and gate conductor to expose tops of the vertical fin channels; selectively forming dielectric spacers on end portions of the gate dielectric and gate conductor adjacent to the tops of the vertical fin channels; depositing an encapsulation layer onto the vertical fin channels; recessing the encapsulation layer with the dielectric spacers serving as an etch stop; and forming top source and drains. A VFET device formed using the present techniques is also provided.
Public/Granted literature
- US20190334017A1 Vertical Transport FET (VFET) with Dual Top Spacer Public/Granted day:2019-10-31
Information query
IPC分类: