Invention Grant
- Patent Title: MEMS microphone system
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Application No.: US16021511Application Date: 2018-06-28
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Publication No.: US11012789B2Publication Date: 2021-05-18
- Inventor: Christoph Hermes , Bernhard Gehl , Arnim Hoechst , Daniel Meisel , Andrew Doller , Yujie Zhang , Gokhan Hatipoglu
- Applicant: Robert Bosch Gmbh , Akustica, Inc.
- Applicant Address: DE Stuttgart; US PA Pittsburgh
- Assignee: Robert Bosch Gmbh,Akustica, Inc.
- Current Assignee: Robert Bosch Gmbh,Akustica, Inc.
- Current Assignee Address: DE Stuttgart; US PA Pittsburgh
- Agency: Maginot, Moore & Beck LLP
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R19/00 ; H04R7/10 ; H04R31/00

Abstract:
A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.
Public/Granted literature
- US20190098418A1 MEMS Microphone System Public/Granted day:2019-03-28
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