Invention Grant
- Patent Title: Coil component
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Application No.: US16017015Application Date: 2018-06-25
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Publication No.: US11017926B2Publication Date: 2021-05-25
- Inventor: Hwan Soo Lee , Sung Min Song , Yoon Hee Cho
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0137677 20171023
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F5/04 ; H01F1/14 ; H01F27/29 ; H01F17/04 ; H01F17/00

Abstract:
A coil component includes a body including a coil including lead portions at both ends thereof and a magnetic material sealing the coil and external electrodes disposed on outer surfaces of the body and connected to the lead portions, respectively. An outer surface of the coil including at least one of an upper surface, a lower surface, and a side surface of the coil includes a surface area increasing portion.
Public/Granted literature
- US20190122795A1 COIL COMPONENT Public/Granted day:2019-04-25
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