- Patent Title: Wafer processing method using a ring frame and a polyester sheet
-
Application No.: US16419139Application Date: 2019-05-22
-
Publication No.: US11018043B2Publication Date: 2021-05-25
- Inventor: Shigenori Harada , Minoru Matsuzawa , Hayato Kiuchi , Yoshiaki Yodo , Taro Arakawa , Masamitsu Agari , Emiko Kawamura , Yusuke Fujii , Toshiki Miyai , Makiko Ohmae
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JPJP2018-108955 20180606
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L23/544 ; H01L21/78 ; H01L21/67 ; C09J7/35 ; C09J7/10 ; B28D5/02 ; C09J5/06
Abstract:
A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyester sheet.
Information query
IPC分类:
