Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16549826Application Date: 2019-08-23
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Publication No.: US11018217B2Publication Date: 2021-05-25
- Inventor: Takashi Ishida , Takahiro Sugimoto , Hiroshi Kanno , Tatsuya Okamoto
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JPJP2018-195696 20181017
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L21/8234 ; H01L27/11556 ; H01L27/11582 ; H01L27/11568

Abstract:
A semiconductor device includes a first semiconductor layer that is an electrically-conductive polycrystalline semiconductor layer and a second semiconductor layer on the first semiconductor layer. The second semiconductor layer is an electrically-conductive polycrystalline semiconductor layer having a smaller average grain size than the first semiconductor layer. A plurality of electrode layers are stacked on the second semiconductor layer at intervals in a first direction. A third semiconductor layer extends in the first direction through the first semiconductor layer, the second semiconductor layer, and each of the electrode layers and contacts the second semiconductor layer. A charge storage layer is between the plurality of electrode layers and the third semiconductor layer.
Information query
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