Invention Grant
- Patent Title: Contact module for a connector assembly
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Application No.: US16522760Application Date: 2019-07-26
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Publication No.: US11018456B2Publication Date: 2021-05-25
- Inventor: David Allison Trout , Douglas Edward Shirk , Justin Dennis Pickel , Timothy Robert Minnick , Margaret Mahoney Fernandes , Tetsuya Katano , Masayuki Aizawa
- Applicant: TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
- Applicant Address: US PA Berwyn; JP Kawasaki
- Assignee: TE CONNECTIVITY CORPORATION,TYCO ELECTRONICS JAPAN G.K.
- Current Assignee: TE CONNECTIVITY CORPORATION,TYCO ELECTRONICS JAPAN G.K.
- Current Assignee Address: US PA Berwyn; JP Kawasaki
- Main IPC: H01R13/6586
- IPC: H01R13/6586 ; H01R13/6461 ; H01R13/514 ; H01R107/00 ; H01R13/6587 ; H01R12/73 ; H01R9/24 ; H01R12/72 ; H01R13/658 ; H01R13/6473 ; H01R13/6585 ; H01R13/6581

Abstract:
A contact module includes a leadframe having signal contacts arranged in pairs. Each signal contact includes a lead having sides extending between inner and outer edges. The contact module includes a dielectric frame supporting the leadframe having a first side and a second side with windows extending through the dielectric frame between the first side and the second side. The windows exposing to air the sides, the inner edges and the outer edges of the corresponding leads along a majority of lengths of the leads. The contact module includes a shield structure having a first ground shield at the first side and a second ground shield at the second side to provide electrical shielding for the signal contacts.
Public/Granted literature
- US20210028582A1 CONTACT MODULE FOR A CONNECTOR ASSEMBLY Public/Granted day:2021-01-28
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