Invention Grant
- Patent Title: Camera unit and mobile body
-
Application No.: US16616208Application Date: 2018-05-16
-
Publication No.: US11019243B2Publication Date: 2021-05-25
- Inventor: Tomonori Agawa , Eiji Oba , Hiroo Suzuki
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2017-106646 20170530
- International Application: PCT/JP2018/018841 WO 20180516
- International Announcement: WO2018/221210 WO 20181206
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G02B7/02

Abstract:
The present technology relates to a camera unit and a mobile body capable of improving Electromagnetic Compatibility (EMC) performance. The camera unit includes a shield arranged at least on a side of one side surface of a sensor substrate to which an image sensor is attached and a contact portion that has conductivity and is provided on the sensor substrate so as to have contact with a portion on a side of a side surface of the sensor substrate of the shield. The present technology is applied to, for example, a camera unit or the like mounted on a mobile body such as a vehicle.
Information query