Invention Grant
- Patent Title: Apparatus of supplying slurry for planarization process and chemical-mechanical-polishing system including the same
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Application No.: US16105904Application Date: 2018-08-20
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Publication No.: US11020839B2Publication Date: 2021-06-01
- Inventor: Achala Akuretiya , Mehrdad Hosni
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Renaissance IP Law Group LLP
- Main IPC: B24B57/02
- IPC: B24B57/02

Abstract:
An apparatus of supplying slurry for a planarization process includes a housing having a first side and a second side and channels extending through the housing from the first side to the second side along a first direction. The channels include a first channel connecting a first inlet on the first side and a first outlet on the second side, a second channel connecting a second outlet on the first side and a second inlet on the second side, a third channel connecting a third inlet on the first side and a third outlet on the second side, and a fourth channel connecting a fourth outlet on the first side and a fourth inlet on the second side. An intermediate portion of the second channel crisscrosses an intermediate portion of the third channel along a second direction crossing the first direction.
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